Our Services
PCB Assembly (PCBA) Services in Shenzhen
Turnkey SMT & through-hole assembly — prototype to volume, ≥99.5% first-pass yield, AOI · X-ray · ICT.
BELI Technologies provides turnkey PCB assembly (PCBA) in Shenzhen — from small-batch prototypes to volume production. Our SMT lines place components from 0201/01005 up to 0.4 mm pitch BGAs at ±0.03 mm accuracy, backed by AOI, X-ray and ICT inspection.
Our PCB assembly service covers everything from prototype to mass production. We provide comprehensive DFM reports before assembly begins, ensuring quality from the start. Our advanced SMT lines handle the smallest components with exceptional precision.
From small batch prototypes to high-volume production, BELI ensures consistent quality through rigorous incoming material control, automated inspection, and comprehensive testing.
Our lines assemble boards from 45 × 45 mm up to 680 × 500 mm, placing components as small as 0201/01005 and BGAs down to 0.4 mm ball pitch at ±0.03 mm precision, with a total capacity of roughly 52 million placements per month. Solder paste inspection (SPI), nitrogen reflow, and wave or selective soldering for through-hole parts keep first-pass yield at or above 99.5%.
We support both turnkey and consignment models with no fixed ratio, so you can hand off the full BOM or supply your own parts. Quick-turn prototype assembly takes 48 hours with no minimum order quantity, while turnkey orders including component sourcing typically take 2 to 3 weeks. Value-added options include conformal coating, potting, and complete box-build assembly.
Capabilities & Specifications
| Max PCB Size | 680 × 500 mm |
|---|---|
| Min PCB Size | 45 × 45 mm |
| Board Thickness | 0.4 – 5 mm |
| Min Component Size | 0201 / 01005 |
| Component Max Height | 25 mm |
| Min Lead Pitch | 0.35 mm |
| Min BGA Ball Pitch | 0.4 mm |
| Placement Precision | ±0.03 mm |
| Packages | DIP / SOP / QFP / PGA / BGA / CSP |
| Soldering Standard | J-STD-001 (requirements for soldered assemblies) |
| Workmanship Standard | IPC-A-610J (acceptability of electronic assemblies) |
| First-Pass Yield | ≥ 99.5% |
Need the full picture? See our complete PCB & SMT manufacturing capability specifications.
Our Process
DFM & Sourcing
Assembly DFM review and component procurement (turnkey or consignment).
Solder Paste & SMT
Stencil printing, SPI, and high-speed SMT placement.
Reflow & Through-Hole
Nitrogen reflow soldering plus wave/selective soldering for THT.
AOI & X-ray
Automated optical inspection and X-ray for BGA/QFN joints.
ICT / Functional Test
In-circuit and functional testing to verify every board.
Value-Add & Ship
Optional conformal coating, potting and box-build before shipment.
Why BELI
- Turnkey from BOM to box-build — sourcing, assembly and test in one place.
- ≥99.5% first-pass yield with AOI, X-ray and ICT on every order.
- Handles fine-pitch SMT down to 01005 and 0.4 mm BGA.
- No MOQ for prototypes — scale to volume with the same line.
Related Services
Further Reading
- Turnkey PCB Assembly for Startups: A Practical GuideTurnkey PCB assembly means one supplier sources every part, fabricates, assembles and tests your boards. Here is who owns what at each build stage.
- Low-MOQ and Small-Batch PCB Assembly GuideNo MOQ for prototypes means the assembler sets no quantity floor - but component MPQ, one-time NRE and panel economics still decide what a small batch costs.
- EVT, DVT, PVT: Hardware Build Stages and Your EMSClear definitions of EVT, DVT, and PVT — typical build quantities, exit criteria, and what your EMS actually does at each hardware build stage.
FAQ
Frequently Asked Questions
What is the maximum board size and smallest component you can place?
Do you offer low-MOQ or small-batch PCBA?
How do you ensure assembly quality?
How fast is prototype assembly?
Get In Touch
We would love to hear from you!
If you'd like more details, please contact us. Our team is ready to help with your PCB needs.