MANUFACTURING AND ASSEMBLY

Manufacturing Capacity

Current products manufacrured include backplanes, HDI boards, High TG boards, High Fequency boards, Flex and Rigid Flex boards, and more.

 

Production Capabilities


Layers: Up to 42

Min Line width/spacing(mil) for inner layers: 3.0/3.0

Min Line width/spacing(mil) for outer layers: 4.0/4.0

Copper weight: 0.5 – 6.0 OZ

Max Aspect Ratio: 11:1Board thickness: 0.2mm-8.0mm

Max Panel size: 18″ * 24″

Min Hole diameter(mil):4

Material: FR-4, High Tg FR-4, Halogen free, High Frequcncy, ( Rogers, Arlon, Taconic, Nelco…)etc.

Surface Treatment: HASL, ENlG, lmmersion Silver, lmmersion Tin, Lead free HASL, etc.

Impedance Control: +/-10%


SMT Production Capabilities


Max PCB size: 490 x 420 mm

Min PCB size: 45x45mm

Board thickness: 0.4-5 mm

Min Components size: 0201-01005

Component max height: 25mm

Min lead pitch:0.35mm

Min BGA ball pitch:0.4mm

Placement precision: +/- 0.03mm

Laser cut for Stencil manufacture for manual, semi-automatic and full automatic solder print machine, the accuracy can be 5 um