MANUFACTURING AND ASSEMBLY
Manufacturing Capacity
Current products manufacrured include backplanes, HDI boards, High TG boards, High Fequency boards, Flex and Rigid Flex boards, and more.
Production Capabilities
Layers: Up to 42
Min Line width/spacing(mil) for inner layers: 3.0/3.0
Min Line width/spacing(mil) for outer layers: 4.0/4.0
Copper weight: 0.5 – 6.0 OZ
Max Aspect Ratio: 11:1Board thickness: 0.2mm-8.0mm
Max Panel size: 18″ * 24″
Min Hole diameter(mil):4
Material: FR-4, High Tg FR-4, Halogen free, High Frequcncy, ( Rogers, Arlon, Taconic, Nelco…)etc.
Surface Treatment: HASL, ENlG, lmmersion Silver, lmmersion Tin, Lead free HASL, etc.
Impedance Control: +/-10%
SMT Production Capabilities
Max PCB size: 490 x 420 mm
Min PCB size: 45x45mm
Board thickness: 0.4-5 mm
Min Components size: 0201-01005
Component max height: 25mm
Min lead pitch:0.35mm
Min BGA ball pitch:0.4mm
Placement precision: +/- 0.03mm
Laser cut for Stencil manufacture for manual, semi-automatic and full automatic solder print machine, the accuracy can be 5 um